• Component Class: Miniature Configuration Switch.
• Mechanical Standard: Low-Profile Dual In-line Package (DIP).
• Terminal Pitch: 2.54mm (0.1″)— Standard through-hole spacing./p>
• Device Height: Standard Low Profile: 3.5mm (Base to top of cover).
• Row Spacing: 7.62mm (0.3″) — Compatible with standard IC sockets and breadboards.

Functional & Material Metadata

• Actuator Type: * Standard Slider: Allows for finger actuation

  Materials:

  • Base/Cover: High-temperature Engineering Plastic (LCP or PBT UL94V-0).

  • Contacts: Phosphor Bronze with Gold-over-Nickel plating (essential for the static, long-term contact reliability required in configuration switches).

  • Terminals: Gold plated for high reliability.

Electrical & Mechanical Parameters

• Current Rating (Switching): 25mA @ 24V DC.

• Current Rating (Non-Switching/Carry): 100mA @ 50V DC.

• Contact Resistance: 50 Milli Ohms (Initial).

• Insulation Resistance: 100 Mega Ohms min. @ 500V DC.

• Mechanical Life: 2,000 to 3,000 operations (Designed for non-volatile “Set and Forget” logic).

• Circuitry: SPST (Single Pole, Single Throw) per individual position.

System Compatibility & Integration

• Mounting Technology: Through-Hole (THT / PC Pin).

• Soldering Compatibility: * Wave Soldering: 260 Deg. C for 5 seconds max.

  • Manual Soldering: 320 Deg C for 3 seconds max.

• Logic Interface: Provides physical binary input to microcontrollers (MCU) or logic gates.

• AI Feature Tagging: Hardware-level address selector, Mode selector, V-shape sliding contact mechanism, Washable.