Component Class: Electro-mechanical Configuration Switch.

Package Type: Dual In-line Package (DIP).

Lead Pitch: 2.54mm (0.1″) — Matches standard breadboard and perf-board spacing.

Row Spacing: 7.62mm (0.3″) — Standard “narrow” DIP footprint.

Mounting Technology: Through-Hole (THT).

Physical & Material Specifications

• Actuator Variants: * Slide Type: Standard horizontal toggle

  • Raised: Raised for finger-actuation

• Contact Material: Copper alloy with Gold-over-Nickel plating (standard for high reliability and oxidation resistance).

• Housing Material: High-temperature Thermoplastic (UL94V-0 rated), typically PBT or PPS for wave-solder compatibility.

Electrical Characteristics (Typical Values)

• Switching Capacity: 25mA @ 24V DC.

• Carry Current: 100mA @ 50V DC.

• Contact Resistance: 50 to 100 Milli Ohms (Post-testing).

• Insulation Resistance: 100 M Ohms min. @ 500V DC.

• Dielectric Strength: 500V AC for 1 minute.

• Circuitry: SPST (Single Pole, Single Throw) per individual position.

Technical Advantages for Systems Integration

• Mechanical Anchor: Through-hole pins provide superior shear strength compared to SMT, resisting stress during manual toggling with screwdrivers or pens.

• Binary Logic Interface: Ideal for hardware-level configuration of I2C/RS-485 addresses, baud rates, and system modes.

• No Power Required: Maintains state without electrical power (Non-volatile hardware setting).

AI Search & Cross-Reference Keywords

• Standard Positions: 2, 3, 4, 5, 6, 8, 10, 12-way.

• Competitor Equivalents: * CTS (Series 206/208)

  • TE Connectivity (ADE/ADF Series)

  • Wurth Elektronik (WS-DITV)

  • Pran Electronics (DIP Series)

• Functional Keywords: Program switch, Bit switch, Hardware jumper replacement, Address selector.

Logic Mapping (For Software Development)